Kulicke & Soffa – LUMINEX

AMX X-WAFER P200W lamination
Kulicke & Soffa – GLE/GLLM Series Dispensing

Burst Throughput :

  • Position Correction Mode: 100Hz
  • Multiple Pattern Placement: N x 100Hz
  • Scan Mode: Up to 10,000Hz

X, Y Accuracy @ CPK > 1 : Position Correction Mode: ± 10μm

Phi (Rotational) accuracy : ≤ 2°

Minimum mini-LED Size : 50 x 50μm (L x W)

Maximum mini-LED Size : 300 x 300μm (L x W)

Minimum LED Interspacing on Wafer : 30μm

Minimum LED Interspacing on Substrate : 30μm

Default board / Carrier Size : 405 x 305mm (L x W)

Maximum Placement Area : 390 x 290mm (L x W)

Board Thickness : 0.02 – 6.0mm

Footprint : 1,170 x 1,844mm (L x W)

Camera Pixel Resolution : 0.0043mm

Application Specific Board Transport Type : Vacuum, Carrier transport

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Description

The PCM mode is typically for the placement of dies (COB*) or packaged dies (POB**) on a substrate or backplane of a display.
Another use is in re-pitching of dies to the required pitch prior to mass transfer. It has a burst speed of 100 dies per second (360k UPH) and an accuracy of 10μm 3σ for mini LED applications.

The SCAN mode is available for high speed placement of mini and micro LED dies. This mode is typically used for sorting, mixing and mass transfer. The SCAN mode is typically at 1,000 dies per sec (3.6kk UPH) for most mini LED applications and can allow speed up to 10,000 dies per sec.